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NTMFS4119N
Power MOSFET
30 V, 30 A, Single N ? Channel,
SO ? 8 Flat Lead
Features
? Low R DS(on)
? Fast Switching Times
? Low Inductance SO ? 8 Package
? These are Pb ? Free Devices
Applications
? Notebooks, Graphics Cards
? Low Side Switch
? DC ? DC
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Typ
2.3 m W @ 10 V
3.1 m W @ 4.5 V
D
I D Max
(Note 1)
30 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
$ 20
V
V
G
Continuous Drain Current
(Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
18
13
A
S
t v 10 s
T A = 25 ° C
30
MARKING
Power Dissipation (Note 1)
Steady
State
T A = 25 ° C
P D
2.3
W
DIAGRAM
D
Continuous Drain Current
(Note 2)
Power Dissipation (Note 2)
t v 10 s
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
6.1
11
8.0
0.9
A
W
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
S
S
S
G
4119N
AYWZZ
D
D
D
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 30 V, V GS = 10 V, I PK = 29 A,
L = 1 mH, R G = 25 W )
I DM
T J , T stg
I S
E AS
89
? 55 to
150
8.0
421
A
° C
A
mJ
4119N
A
Y
WW
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
THERMAL RESISTANCE MAXIMUM RATINGS
T L
260
° C
ORDERING INFORMATION
Shipping ?
Device
Package
Parameter
Symbol
Value
Unit
NTMFS4119NT1G
SO ? 8 FL
1500 / Tape &
Junction ? to ? Case ? Steady State
Junction ? to ? Ambient ? Steady State (Note 1)
Junction ? to ? Ambient ? t v 10 s (Note 1)
R q JC
R q JA
R q JA
1.3
53.7
20.5
° C/W
NTMFS4119NT3G
(Pb ? Free)
SO ? 8 FL
(Pb ? Free)
Reel
5000 / Tape &
Reel
Junction ? to ? Ambient ? Steady State (Note 2) R q JA 138.5
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 6
1
Publication Order Number:
NTMFS4119N/D
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